| 1. | Solderability tests for surface mounted devices
表面组装元器件可焊性试验 |
| 2. | Surface mount solderability test
表面的可焊接性试验 |
| 3. | Solderability test method
软钎焊性试验方法 |
| 4. | Test methods for bare wires - solderability test of coating - solder globule method
裸电线试验方法镀层可焊性试验焊球法 |
| 5. | Solderability tests for component leads , terminations , lugs , terminals , and wires
元件引线终端接线片端子和电线的可钎焊性试验 |
| 6. | Solderability tests for component leads , terminations , lugs , terminals and wires
元件引线接线端焊片接头和金属丝的软钎焊性试验 |
| 7. | Is solderability test being performed on all products & surface finishing ? describe your test method
有无对所有的产品和表面镀层进行可焊测试？描述您的测试方法。 |
| 8. | Environmental testing - tests - test ta - soldering - solderability testing by the wetting balance method
环境试验.试验.试验2 . 1ta :钎焊.用湿平衡法进行钎焊性试验 |
| 9. | Is solderability test being performed on all products & surface finishing ? describe your test method
可焊性测试是否对所有的产品和表面处理都做？说明你们的测试方法。 |
| 10. | Environmental testing part 2 : tests . test ta : soldering . solderability testing by the wetting balance method
环境试验.第2部分:试验.试验ta :软钎焊.用湿平衡法测试可焊性 |
